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CN/EN

產(chǎn)品與市場(chǎng)

S7045G

特點(diǎn)

● 高Tg>170℃ (DSC),無(wú)鹵材料
● 低插損,Dk/Df @1GHz: 4.30/0.010
● 更低的Z軸熱膨脹系數,優(yōu)異的通孔加工性

● 優(yōu)異的耐CAF性能

● 使用RTF銅箔能獲得更低的信號損耗

應用領(lǐng)域

● 服務(wù)器、交換機、路由器、基站、背板和線(xiàn)卡
  • 產(chǎn)品性能
  • 產(chǎn)品證書(shū)
  • 資料下載
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 175
Tg IPC-TM-650 2.4.24.4
DMA
190
Td IPC-TM-650 2.4.24.6 5% wt. loss 390
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 40
After Tg ppm/℃ 210
50-260℃ % 2.3
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min >60
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.30
IPC-TM-650 2.5.5.5
10GHz
-- 4.15
IEC 61189-2-721
10GHz -- 4.50
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0100
IPC-TM-650 2.5.5.5
10GHz
-- 0.0130
IEC 61189-2-721
10GHz -- 0.0130
Peel Strength (1oz RTF copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.0
125℃ N/mm
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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