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Synamic 6
特點(diǎn)
● 高Tg 205℃ (DMA)● 低Dk/Df
● 更優(yōu)良的耐熱性，Td＞400℃, T300＞60min
● 更低的Z軸熱膨脹系數，優(yōu)異的通孔可靠性
● 更低的吸水率，優(yōu)異的耐濕耐熱性
● 兼容無(wú)鉛制程
應用領(lǐng)域
● 服務(wù)器、交換機、存儲、路由器、基站BBU等
● 高頻測量?jì)x器等
● 光通信產(chǎn)品
- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 205 |
| 2.4.25D |
DSC |
185 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 402 |
|
T288 |
2.4.24.1 | TMA | min | 120 |
| T300 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 50 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.0 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.70 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.68 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.99 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0021 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0036 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0046 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.85 [4.86] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.